Faqs

In the 2004 Fine particle Society, Jacques C.J. van der Donck et al. showed SEM images of similar areas at 20,000X magnification. Silica particles, with sizes in range from 30 to 100 nanometers were dispersed on a Si wafer and images and particles were counted. After cleaning, no particles were found in many test image areas. These images and their counting statistics clearly show that the CO2 Snow Jet can remove particles down to 30 nanometers or 0.03 microns with excellent efficiencies.

Sherman{1994} has qualitatively demonstrated particle removal. The pair of micrographs at 1000x magnifications demonstrates particle removal effectiveness by comparing the exact same areas before and after cleaning. A silicon wafer was scribed with a carbide tip, and many micron and submicron particles were generated near the scratch. After CO2 snow cleaning, the second micrograph, also at 1000x magnification, shows no particles. This example demonstrates the cleaning of silicon particles from a substrate and this data would be typical of particle removal from many different substrates including other wafers, glass, ceramics, metals, etc.

Sherman{1994} provided further microscopic evidence of organic removal by comparing the exact same areas before and after cleaning a facial grease residue. A pair of micrographs is shown below at 1000x magnification of the same area of a scribed silicon wafer before and after cleaning. The initial wafer condition is shown below with extensive contamination:

and after CO2 snow cleaning, no contamination is observed.

This visual evidence of removing organic contamination is typical for many surfaces and materials.

The above two older examples are simple optical examples showing the power of CO2 Snow Cleaning.


		In the 2004 Fine particle Society, Jacques C.J. van der Donck et al. showed SEM images of similar areas at 20,000X magnification. Silica particles, with sizes in range from 30 to 100 nanometers were dispersed on a Si wafer and images and particles were counted. After cleaning, no particles were found in many test image areas. These images and their counting statistics clearly show that the CO2 Snow Jet can remove particles down to 30 nanometers or 0.03 microns with excellent efficiencies. Sherman{1994} has qualitatively demonstrated particle removal. The pair of micrographs at 1000x magnifications demonstrates particle removal effectiveness by comparing the exact same areas before and after cleaning. A silicon wafer was scribed with a carbide tip, and many micron and submicron particles were generated near the scratch. After CO2 snow cleaning, the second micrograph, also at 1000x magnification, shows no particles. This example demonstrates the cleaning of silicon particles from a substrate and this data would be typical of particle removal from many different substrates including other wafers, glass, ceramics, metals, etc. Sherman{1994} provided further microscopic evidence of organic removal by comparing the exact same areas before and after cleaning a facial grease residue. A pair of micrographs is shown below at 1000x magnification of the same area of a scribed silicon wafer before and after cleaning. The initial wafer condition is shown below with extensive contamination: and after CO2 snow cleaning, no contamination is observed. This visual evidence of removing organic contamination is typical for many surfaces and materials. The above two older examples are simple optical examples showing the power of CO2 Snow Cleaning.
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